Los Angeles, USA, March 23, 2026? — The Optical Fiber Communication Conference and Exhibition (OFC 2026), the most influential annual event in the global optical communications field, has successfully concluded. Under the theme "Connecting the World", the event gathered over 700 leading companies from more than 90 countries, witnessing the innovation and breakthroughs of next-generation optical communication technologies.

As a leading supplier in the silicon photonic integrated chip sector, Xphor made a significant impact with its full portfolio of high-speed silicon photonic chips and cutting-edge solutions, becoming a major focal point of the exhibition through its hard-core technological prowess and mass-production capabilities.

Currently, AI computing demand is growing exponentially, placing unprecedented requirements on data centers for high-speed, low-power, and highly reliable interconnect technologies. Aligning with industry trends, Xphor comprehensively launched its full-scenario, high-speed silicon photonic integrated chip solutions for AI clusters, cloud data centers, and autonomous driving.

? Full-Series 400G/800G/1.6T Mass-Production Silicon Photonic Chips

Based on its self-developed low-loss, high-efficiency 100Gbps/200Gbps silicon photonics technology platform, Xphor showcased mass-produced 400G DR4 / 800G DR8, and 800G DR4 / 1.6T DR8 Tx transmitter integrated chips, alongside chips like 800G 2×FR4 and 1.6T 2×FR4. These chips feature on-chip integrated, large-tolerance 1dB bandwidth passive MUX. The chips, delivered in high volumes, are characterized by high consistency and reliability.

? Comprehensive Display of Cutting-Edge Technologies

To address the demand for higher bandwidth in Scale-out networks, the company showcased single-wavelength 400Gbps silicon-based and LNOI integrated chips. For Scale-up applications, Xphor demonstrated 16x200Gbps and 32x200Gbps transceiver-integrated silicon photonic chips. For Scale-cross scenarios, 800G ZR and Coherent Lite silicon photonic chips were presented. These solutions feature low power consumption, low latency, and support customized development.

? Beyond AI Interconnect

In addition to its high-speed interconnect and high-density integrated chip products for AI, Xphor also showcased FMCW LiDAR chips for sensing applications, supporting fields such as autonomous driving, industrial inspection, and robot navigation.

Live Demos Earn Rave Reviews, Hard-Core Performance Wins Global Recognition

During the exhibition, Xphor's booth (South Hall #439) drew massive crowds, attracting experts from global top-tier cloud providers, equipment manufacturers, and module makers for in-depth discussions.

Through displays of chip and wafer samples, live on-site demonstrations, and detailed technical explanations, the team showcased the core advantages of Xphor chips in performance, power efficiency, and integration density. With support from global partner Keysight, Xphor demonstrated perfect compatibility of its 200G/lane FRO and LPO solutions with different IC vendors, as well as high-density NPO solutions. The outstanding chip performance and system performance received high praise from upstream and downstream partners during on-site exchanges. 

Industry experts commented that Xphor's silicon photonics solutions provide highly competitive, optimal answers to challenges like the "power wall" and "bandwidth wall" in AI computing clusters.

Collaborating with Ecosystem Partners to Build an Optics-Enabled Future

As a silicon photonics enterprise with over 20 years of R&D and mass-production experience, Xphor consistently adheres to an open cooperation model, promoting the rapid commercialization of technology.

At OFC, the company engaged in deep collaboration with the industry's upstream and downstream, jointly exploring innovation paths for optical interconnect in the AI era.

A representative from Xphor stated:

"AI is reshaping data center architecture. With silicon photonics as our core technology, Xphor will join hands with global partners to build more efficient and greener computing infrastructure, facilitating the full arrival of the AI computing power era."

While OFC 2026 has concluded, Xphor's technological journey continues. Moving forward, the company will continue to deepen its expertise in silicon photonics, leading the new era of AI computing power with even more advanced products and solutions.

About Xphor

Xphor is an international silicon photonics chip company with geographic diversification to support global customer needs. The company possesses a world-leading R&D team and has established deep partnerships with top global chip foundries and downstream module manufacturers. It is committed to providing high-performance core optical interconnect chips for fields such as artificial intelligence, data centers, and autonomous driving.